RedMagic 11 Pro Series Dual cooling, UDC display, and massive battery for next‑gen mobile gaming

RedMagic has confirmed an October 17 launch for the 11 Pro series, comprising the RedMagic 11 Pro and RedMagic 11 Pro+ as successors to last year’s 10 Pro series. Official teasers highlight a next‑gen touch chip, a full‑screen UDC panel, a new aesthetic, and water cooling in addition to the familiar internal fan.

Cooling breakthrough

The “Feng Shui dual cooling” approach integrates an internal high‑speed fan with a water‑cooling setup to sustain peak performance under load, a first for the brand’s phones. RedMagic’s messaging emphasizes a combined air + liquid design with micron‑level sealing that also targets IP68 dust and water resistance, a barrier that has historically challenged gaming phones with active fans.

Display and inputs

A flat 6.8‑inch under‑display camera panel at up to 165 Hz and 1.5K resolution is positioned as a true full‑screen solution with a dedicated UDC Pro display chip for improved uniformity over the camera area. Gaming niceties include 520 Hz shoulder triggers, a new top‑tier touch control chip with 200+ game optimizations, RGB lighting effects tied to game events, and an in‑display 3D ultrasonic fingerprint reader.

Performance platform

The series is confirmed to run Qualcomm’s Snapdragon 8 Elite Gen 5, with RedMagic positioning it for substantial CPU uplift and better energy efficiency on TSMC 3 nm silicon. Early database sightings and leaks around the platform and device family point to flagship‑class benchmarks and configurations typical of high‑end gaming phones.

Battery and charging

A battery capacity around or above 8000 mAh is expected, representing a sizeable jump from the 10 Pro’s 7050 mAh, with fast charging upgrades in tow. RedMagic materials tout 120 W charging capable of a full refill in about 18 minutes and “bypass charging” that powers the phone directly to keep battery temps low during gaming.

Thermals in practice

RedMagic cites a 23,000 RPM turbo fan and a large 3D VC plate around 12,000 mm² that can drop device temperatures by roughly 5–8 °C, keeping the backplate about 38 °C after an hour of heavy play in internal tests. The company also claims total cooling capacity above 10 W and noise tuning that makes active cooling practical for extended sessions, aligning with its long‑standing active + passive cooling strategy.

Cameras

A 50 MP main camera with OIS paired with a 50 MP ultra‑wide aims to lift imaging beyond typical gaming‑phone “good enough” territory, while a 32 MP under‑display selfie camera is tuned via the UDC Pro chip for more natural results. While photography isn’t the core brief, the dual‑50 MP setup and algorithm updates are positioned to deliver a credible all‑rounder experience.

The series continues the transparent, tech‑forward aesthetic, exposing the internal fan and circuitry with customizable RGB on the camera module, alongside micron‑level 3D lithography textures on the body. Achieving an IP68 rating alongside an active fan is a headline claim for this generation, enabled by detailed sealing measures if final certification matches teasers.

Expect standard and high‑end configurations, with prior RedMagic pricing patterns suggesting a competitive flagship range if the rumored RMB 4,999–6,299 guidance holds at launch. Formal market‑by‑market details will follow the China reveal, with final specs, prices, and bundles to be confirmed at the event.

 for gamers

If the hybrid air‑water cooling and IP68 claim materialize, RedMagic will have addressed two long‑standing pain points: sustained performance without thermal throttling and real durability for daily carry beyond desk‑bound gaming. Coupled with the UDC full screen, high‑Hz panel, shoulder triggers, and large battery, the 11 Pro series positions itself as a specialized gaming flagship without giving up mainstream usability.